4PC IC Chip BGA Reballing Stencil Set Solder Template For Samsung,Huawei,Android

Brand: Unbranded

Package Contents: BGA Reballing Stencils

Quantity: 4 Sheets

MPN: Does Not Apply

Country/Region of Manufacture: China

4PC IC Chip BGA Reballing Stencil Set Solder Template For Samsung, HUAWEI, Android, iPad

Description:

100% brand new and high quality.

Feature:

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications:

Item Type: BGA Reballing Stencil

Material: Stainless Steel

Size: Standard Size

Color: Silver

Quantity: 4PCS

Note:

No retail package.

Transition: 1cm=10mm=0.39inch

Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.

Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes:

4 x BGA Reballing Stencils